Resistive electronic components automatic forming hot bonding tin equipment
Introducing our high-quality Resistive Electronic Components Automatic Forming Hot Bonding Tin Equipment, the perfect solution for your bending, molding, and hot stamping needs. This automation equipment is ideal for the sensor industry, home appliance industry, and electronics industry, and can handle various electronic components with ease.
Our Resistive Electronic Components Automatic Forming Hot Bonding Tin Equipment is designed with advanced technology, ensuring fast and efficient production. It features automatic feeding, bending, molding, shear foot, and clip material, allowing for precise and accurate processing of electronic components. The machine can dip in size from 2.5mm to 4.0mm, and the dip depth can be adjusted to fit your specific needs.
With its sturdy and durable construction, our Resistive Electronic Components Automatic Forming Hot Bonding Tin Equipment is built to last. It can handle high-volume production while maintaining consistent quality and reliability. The machine is also user-friendly, with an easy-to-use interface that makes operation simple and hassle-free.
Investing in our Resistive Electronic Components Automatic Forming Hot Bonding Tin Equipment will enhance your production process, resulting in high-quality electronic components that meet your exact specifications. Trust in our years of experience as an intelligent manufacturing automation equipment manufacturer and solution provider.
Model: CR-8626
Customized model
Efficiency：3000~3600PCS/H
1. This automation equipment, straight resistive components bending molding cutting foot after hot stamping tin, tin size 2.5-4.0mm, tin depth can be adjusted
2. Automatic feeding, bending, and forming cutting foot and clip material process will not cause dirt, damage, glass case rupture and other bad;
3. Bending bending leads do not touch the glass case;
4. Bending components after the two pins remain parallel state
5. In order to ensure the effect of hot stamping tin, the components need to be dipped in flux before the tin;
6. The component dip flux, dip tin process does not appear in the component glass case damage, rupture and other bad;
7. Automatic feeding and counting
- 2Equipment Operation Flow Chart
![Resistive electronic components automatic forming hot bonding tin equipment 8]()
- 3Before And After Diagram Of Resistor Element Molding
If you have any questions about our products or services, feel free to reach out to customer service team.Provide unique experiences for everyone involved with a brand. We've got preferential price and best-quality products for you.
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Contact Person: Mr.Dane Lu
Mobile And WhatsApp: +86-136 8687 1913
Email Address: sales01@szcjrmachine.com
Address: Building 16, Longwang Temple Industrial Park, Baishixia Community, Fuyong Street, Baoan District, Shenzhen City, Guangdong province, China.